First Seal – Two Component Potting Adhesive
Two-Component Potting Adhesive for Electronics Protection
Key Features:
- Strong electrical insulation properties
- High resistance to temperature and environmental factors
- Suitable for complex electronic assemblies
- Customizable curing properties
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Description
Two-component silicone is distinguished and named for the single component silica gel. This product consists of two components and cures after mixing the two components in the right proportion.
Generally divided into condensation type and addition type, the biggest difference between the two is condensation type will release low-molecular substance and addition type will not, so condensation type potting adhesive will shrink during curing and addition type potting will not.
Key Features:
- Strong electrical insulation properties
- High resistance to temperature and environmental factors
- Suitable for complex electronic assemblies
- Customizable curing properties
APPLICATION
Two – Component condensation type potting : it mainly used in circuit boards, LED power supply, LED outdoor lamps, automotive electronic modules, electrical appliances, light sources, lighting and ancillary devices for potting protection and play the role of sealing waterproof, insulation.
Two – Component addition type potting : it mainly used in circuit boards, LED power supply, LED outdoor lamps, automotive electronic modules, electrical appliances, light sources, lighting and ancillary devices for potting protection and play the role of sealing waterproof, insulation.
TECHNICAL SPECIFICATION
Two – Component condensation type potting :
| Model | Proportion (Weight) |
Viscosity-BF (CP) | Color | Viscosity – AF (CP) | Density (g/ml) |
Surface Dry Time (Min) |
Full Cure Time (H) | Hardness (Shore A) |
Dielectric Strength (kv/mm) |
| FS-5401 | 1 0 : 1 | 2500 / 100 | Black | 2400 | 1.2 | 40 – 60 | 3 – 5 | 15 | > 21 |
| FS-5403 | 1 0 : 1 | 2500 / 100 | White | 2400 | 1.2 | 40 – 60 | 3 – 5 | 15 | > 21 |
| FS-5406 | 1 0 : 1 | 2500 / 100 | Transparent | 1600 | 1.0 | 40 – 60 | 6 – 8 | 15 | > 21 |
Two – Component addition type potting :
| Model | Proportion (Weight) |
Viscosity-BF (CP) | Color | Viscosity – AF (CP) | Density (g/ml) |
Surface Dry Time (Min) |
Full Cure Time (H) | Conductivity (w/m – k) | Hardness (Shore A) |
Dielectric Strength (kv/mm) |
| FS-6401 | 1 : 1 | A: 2000 – 2500 B : 2500 – 3200 |
Grey | 2200 – 3000 | 1.53 | 10 – 20 | 2 – 4 | 1.0 | 56 – 60 | > 21 |
| FS-6402 | 1 : 1 | A: 2000 – 2500 B : 2500 – 3200 |
Grey | 2200 – 2800 | 1.4 | 40 – 60 | 2 – 4 | 0.9 | 56 – 60 | > 21 |
INSTRUCTION
Two – Component condensation type potting :
- Before use the a component is fully stirred evenly, B components in the sealed state shake evenly, and then according to the weight ration of A:B = 10:1, into the mixing tank mixing evenly. If the weight of the B Component is more the curing time is faster
- put the mixture into the container, if the depth is deep, suggest to vacuum deaeration, to prevent bubbles and pinholes after curing the adhesive surface.
Two – Component addition type potting :
- Before use the A component and B component in their respective containers fully mixing evenly and then according to the weight ratio A:B = 1:1 put into the mixing tank mixing evenly.
- Put the mixture into the container. Curing at room temperature or heating in the winter, it will take a long time to cure, suggested by heating curing curing under 800 C for 15-30 minutes, and room temperature, generally takes about 3 ~ 5 hours curing.
CAUTION
- Glue should be sealed storage. The mixture should be used once to avoid waste.
- This Product is not dangerous, but do not eat and into the eyes.
- If contact with the skin, wipe clean and then rinse with water if contact with eyes, immediately wash with water and go to the hospital to check.
- After a long period of storage, there will be precipitation in the glue. Please mix evenly to use and does not affect the performance following substances will not affect the curing
- N,P,S Organic Compounds
- Ionic Compounds of Sn, Ob, Hg, As and other elements
- Containing alkynes and vinyl compounds
- In order to avoid the above phenomenon the use of the circuit boars as far as possible to wipe clean the remaining rosin, try to use low lead content of solder. It can also use three anti-paint soaked, and then use glue.
- Before a large amount of use, please try a small amount of trial to confirm is it appropriate.
PACKING
- Two – Component condensation type potting : 11KG/ set, 22KG set (Size of 10LBarrel : D26 X H28 cm)
- Two – Component addition type potting : 50KG / set (Size of 20LBarrel : D30 X H38.5 cm)
- Customized special package
STORAGE AND TRASPORT
- The storage period see the TDS.
- Such products are non hazardous and can be transported in general chemicals
