LASA 50/50 Tin/Lead Soldering Paste | Type – T3
– Exhibits excellent wettability.
– Ensures minimal slumping and prevents solder balling and bridging.
– Low colour flux residue offers superior cosmetic appearance.
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Description
- Minimizes Soldering defects and long term reliability with defect free performance. Shiny and smooth solder joints.
- No clean flux residues are non-tacky and non-corrosive which gives long terms electrical reliability hence no post solder cleaning is required.
- No change in viscosity after continuous printing thus gives stable printing on high-density electronic assemblies. No bridging, No solder ball, and No slumping after continuous printing.
- INSTRUCTIONS TO USE: a. SOFTENING BEFORE USING:- Take out the solder paste from the refrigerator and keep it at room temperature for 1-1.5hr. Stir it in softening machine at 300 to 400 RPM for 2-3 mins or stir by using a spatula for approx. 3-4 mins.
- Do not keep the speed of softening machine too high c. Add sufficient quantity of solder paste on the stencil. d. Keep the container of solder paste airtight to avoid moisture interruption. Otherwise, moisture interruption may result in solder balls/flakes.
